Delamination occurs when moisture, extreme heat, or severe physical stress causes the internal fiberglass and copper layers of an SSD's PCB to separate or bubble. This separation tears apart the internal vertical vias (the tiny conductive tunnels connecting different circuit layers), causing intermittent data drops, fatal initialization errors, or total power failure.
Operating within our contaminant-free clean room environment to prevent airborne dust from sealing into the board's internal layers, technicians perform a structural stabilization process. Engineers use micro-injection needles to insert aerospace-grade thermal-conductive structural epoxy directly into the delaminated pockets. The PCB is then placed under uniform compression using specialized alignment jigs and cured in a controlled thermal chamber. Once the physical layers are bonded back together, technicians use micro-probing stations to locate any fractured vias and install ultra-thin micro-jumpers to bypass the broken internal joints.
