When a Solid-State Drive (SSD) suffers catastrophic physical trauma or severe PCB degradation, recovering your data requires direct physical access to the storage medium. Inside our certified Class 100 ISO 5 clean room, engineers perform precision micro-soldering and reballing to safely detach the NAND flash chips from a damaged circuit board.
Because NAND flash chips are attached via a Ball Grid Array (BGA)—where microscopic spheres of solder establish electrical connections beneath the chip—ordinary repair tools are useless. Our specialists use specialized infrared rework stations and thermal profiling to heat the PCB to the exact temperature required to liquefy the solder without causing thermal stress to the delicate internal memory cells. Once detached, the chip undergoes a reballing process where fresh, microscopic solder spheres are meticulously aligned and fused to the chip contacts. This allows the memory chip to be successfully mounted onto a donor board or inserted into a specialized physical chip reader, paving the way for full raw data extraction.
