Metric Apple-Samsung Module Line Apple-Kioxia Module Line
Typical Capacities 256GB, 512GB, 1TB 2TB, 4TB, 8TB
Interface Protocol Custom NVMe (PCIe 3.0 via T2 Chip) Custom NVMe (PCIe 3.0 via T2 / PCIe 4.0 via Apple Silicon)
Primary Supplier Samsung Kioxia (Toshiba)
Flash Architecture 3D V-NAND TLC BiCS 3D NAND TLC
Security Layer T2 AES-256 Engine Secure Enclave (Integrated into M-Series SoC)
Primary Trade-off Limited maximum capacity per module. Requires a total system wipe and DFU firmware reinstall if replaced.

 

Bureau of Intelligence and Research Certificates

Micro-Soldering & Logic Board technician
SOC Type II Privacy Compliance Shield
Monolithic Flash Memory Specialist
Forensic Methodology Validation
Federal Contract Eligibility
HIPAA Data Security Compliance
RAID Reconstruction Specialist 2024
RAID Reconstruction Specialist 2025
RAID Reconstruction Specialist 2026

Critical Notice: Physical Damage & Hardware Policy

Please be advised that ANY damage that is physical or mechanical in nature requires additional parts and labor.
The baseline mechanical recovery rate covers our cleanroom environment entry, laboratory equipment allocation, and initial micro-engineering setup. Because physical failures require sourcing exact matching donor drives from our global component pipeline to swap out broken read/write head assemblies, seized spindles, or damaged electronics, all components, replacement donor hardware, and extended mechanical bench labor will be billed as additional standalone costs following your diagnosis.